Presented by PCB007

Event: Semicon China 2009,
Date: 17 March 2009 to 19 March 2009
Location: Shanghai, China
Description: SEMICON China is a platform to connect the world’s fastest-growing and most dynamic microelectronics market. Vary kinds of products, technologies, and brands from difference manufactures and suppliers are showcased in front of the most qualified audience of industry professionals in China.

Interview with WESI Technology, Dr. Chenting Lin
Semicon China: A Growing Chip Packaging Technology Alliance
WESI Technology was formed last year, a joint venture between WKK and ECI Technology. Dr. Chenting Lin updates viewers on the company’s progress and what advances it is making in the chip packaging arena.