・Increased area productivity with higher speeds and a compact footprint.
・Enhanced reliability and stability in production leveraging various monitoring functions.
・Reduced running costs by saving power and air consumptions.

Improving reliability and stability: Various monitoring functions contribute to a higher level of quality control.

Reducing running costs: Air consumption and power consumption reduced

Optional supports for automation : Auto recovery function, Capillary auto change unit, support for automatic magazine transfer mechanism.

Bonding

• Capable of handling AU, AG, CU ,PCC wires, achieveing  high speed bonding of 40ms/2mm
• Bonding accuracy of ±2.0μm (3σ) standard
• Bonding Speed: 40 ms/2 mm wire with loop control and force detection mode Using Shinkawa standard device
• Bonding Wire Length: 0.5 - 8 mm maximum (Varies depending on device conditions)
• Resolution： XY-table: 0.1 μm Z-axis: 0.1 μm
• Vibration Control： Shinkawa NRS - Non Reaction Servo System
• Max Bonding Area： X：56mm,　Y：87 mm
• Wire Size： Au / Cu　φ15–65 μm
• Bonding Force： 3–1,000gf
• No. of Bonding Wires： 30,000 wires maximum
• Loader/Unloader： Fully automatic magazine stacker system (Option: stocker system)）
• Workpiece Size： Width： 30– 95 mm (20–93 mm when carrier type)，Length： 115–300 mm，
• Thickness： 0.1–0.5mm (optional support for 0.5mm to 2 mm)