- 4,500 UPH (0.8 sec/unit)
The top mounting capability in Flipchip bonders
- +/-10μm (3σ) Mounting accuracy
- YWF Wafer Supply Unit "6/8/12 inch", "Expand Ring", and "θ angle correction" applicable
- 0.6×0.6mm to 18×18mm Components applicable
Manufacturer: Yamaha Motor Co., Ltd.
Model No.: YSH 20
- 4,500 UPH (0.8 sec/unit)
The top mounting capability in Flipchip bonders
- +/-10μm (3σ) Mounting accuracy
- YWF Wafer Supply Unit "6/8/12 inch", "Expand Ring", and "θ angle correction" applicable
- 0.6×0.6mm to 18×18mm Components applicable
Manufacturer: Yamaha Motor Co., Ltd.
Model No.: YSH 20
URL: http://www.yamaha-motor.co.jp
- 4,500 UPH (0.8 sec/unit)
The top mounting capability in Flipchip bonders
- +/-10μm (3σ) Mounting accuracy
- YWF Wafer Supply Unit "6/8/12 inch", "Expand Ring", and "θ angle correction" applicable
- 0.6×0.6mm to 18×18mm Components applicable
