- For outer layer panel and pattern copper plating
- Fine and homogenous structure leads to uniform plating
- Free from contamination and will not gum up plating solution
- For outer layer panel and pattern copper plating
- Fine and homogenous structure leads to uniform plating
- Free from contamination and will not gum up plating solution
Model No.: Copper Ball 27mm, 45mm, 55mm
URL: http://www.mmc.co.jp
- For outer layer panel and pattern copper plating
- Fine and homogenous structure leads to uniform plating
- Free from contamination and will not gum up plating solution