• G-Line is one of flagship for the molding system, and this system has been supporting the massproduction in the field for over a decade. Following G-Line’s prominent concept and performance and to beyond G-Line, this new Transfer molding system, GTM-X is developed.
• Semiconductor devices are being changed and these new generation devices require higher encapsulation technologies, higher productivity and higher device quality.
• GTM-X is accommodating to large 100×300mm substrate and 2 or more substrates per mold. The machine cycle time is also improved, and the compatibility of the G-Line peripheral equipments are considered as well.
• GTM-X can support any manufacturing style of customer’s requirements with the system line-up from manual to full auto.