Die Attach, Bonding, Flip Chip Bonding, Ultrasonic bonding system.
Die Attach, Bonding, Flip Chip Bonding, Ultrasonic bonding system.
Manufacturer: Athlete
Model No.: Die Bonder
URL: www.athlete-fa.co.jp
Die Attach, Bonding, Flip Chip Bonding, Ultrasonic bonding system.