- High density plasma technology that integrates inductively coupled plasma (ICP) and hollow cathode plasma (HCP) designs simultaneously.

- The integrated design of ICP and HCP can ensure plasma density in the cavity and improve processing speed.

- The use of water-cooled electrode design can ensure the consistency of electrode surface impedance and increase process stability.

- Multiple process gases or mixtures can be selected.

- Featuring multiple designs that are easy to maintain and have low maintenance costs.

- High affinity human-machine interface design.

- This machine can be customized to meet the special needs of customers.

- Multi step process parameters can be implemented.

- Depending on the type of board, it can be designed to be suitable for both upper and lower feeding table carts.