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Sub-micron Bonding Platform Finceplacer Siggma/ Fineplacer Pico 2

Manufacturer:  Finetech

Model No.:  Finceplacer Siggma/ Fineplacer Pico 2

URL:   https://finetech.de/

Specifications

Specifications:

- 0.5 um/ 3 microns placement accuracy

- Little maintenance - Many modular options

- Minimal set-up time

Wide Application:

- Sintering / Thermocompression / Ultrasonic /

- Eutectic /Adhesive /Vacuum

Sub-micron Bonding Platform Finceplacer Siggma/ Fineplacer Pico 2

Manufacturer:   Finetech

Model No.:   Finceplacer Siggma/ Fineplacer Pico 2

URL:   https://finetech.de/

Specifications

Specifications:

- 0.5 um/ 3 microns placement accuracy

- Little maintenance - Many modular options

- Minimal set-up time

Wide Application:

- Sintering / Thermocompression / Ultrasonic /

- Eutectic /Adhesive /Vacuum

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