- Lamination of Film Mask to BGA and micro BGA products.
- Lamination of Primary Imaging Film onto 3-Dimensional Surfaces.
- Evacuation of Liquid Photo-Imageable Solder Mask.
- Lamination of Dielectric Coating in Preparation for the Screening of Additional Circuitry.
- Application of tape-supported strippable encapsulant for chip-scale interconnect processing.
- Lamination of pressure-sensitive adhesives to glass and other substrates for flat panel displays.
- Application of Coatings for Multi-wire Boards. Upon completion of a cycle, the drawer mechanism is retracted and the products removed for further processing.