• Capable of handling bare Cu wire and Pd coated Cu wire, achievi ng high speed bonding of 45ms/2mm
• Bonding accuracy of ±2.0μm (3σ) achieved
• Shorter product-type changeover time achieved by digitalizing the flow rate of inert gas
• Wire bonder with new SimLoop as a standard function
• Reduced working time with Automated loop shape optimization and Loop shape editor
• Approx. 7% UPH improvement by Overdrive mode

• Bonding Accuracy: ±2.0 μm（3σ）Using Shinkawa standard device
• Correction of Bonding Position: System to check and correct capillary offset prior to bonding through Shinkawa RPS
(In combination with offset amount correction with temperature detection)
• Bonding Speed: 45 ms/2 mm wire with loop control and force detection mode Using Shinkawa standard device
• Bonding Wire Length: 8 mm maximum (Varies depending on device conditions)
• Resolution： XY-table: 0.1 μm Z-axis: 0.1 μm
• Vibration Control： Shinkawa NRS - Non Reaction Servo System
• Bonding Area： X：±28 mm,　Y：±43.5 mm
• Wire Size： Au / Cu　φ15–50 μm
• Bonding Force： 3–1,000gf
• No. of Bonding Wires： 30,000 wires maximum
• Loader/Unloader： Fully automatic magazine stacker system (Option: stocker system)）
• Workpiece Size： Width： 20– 95 mm (20–93 mm when carrier type)，Length： 95–300 mm，
• Thickness： 0.07–2.0 mm (Varies depending on type of device)
（Conversion parts are required when thickness changes）
• Production Management： Management of equipment availability through production management monitoring screen