WCM-330 series has in-line concept for wafer loading/unloading, compound feeding, encapsulation and vision inspection.
This system handles the wafer without any damage nor contamination and encapsulates high quality products.
The press system is high precision mechanical press, specially developed for WLP. This system can handle either liquid or granular compound to accommodate to the customer’s requirement.
85ton (High pressure model)
Type: Auto or MS (Manual System) *1
36ton (Standard model)
Type: Auto or MS (Manual System)
*1WCM-f400 press unit can be utilized as the manual system