• It is the Chip to Substrate flip chip bonder for TCB process
• High throughput achieved by 2 Head Modular structure
• Capable of high-speed, high-accuracy flip chip bonding by adopting probe camera technology and linear motor that applies Shinkawa NRS technology
• Both high precision force control and position control as well as high-force bonding achieved at bond head’s Z-axis by high/low force switching function
• Cycle time reduced by short heating and cooling with high speed pulse heater
• Capable of various plunge-up methods as well as thin die pickup and handling
• Molten solder detection function and high-precision Z control reduce damage on devices (under low force mode)
• Stable NCP pre-dispense application achieved by dispense amount feedback function
• Process monitoring and management function securing stable quality and process portability

• Bonding Method: Pulse heat thermocompression
• Bonding Accuracy: ±2μm (3σ)　by Shinkawa’s standard condition
• Machine Cycle Time: 1.6s/chip (excludes process time) by Shinkawa’s standard condition
• Bonding Force: 1 - 300N
※Capable of selecting bond force control method at bonding process
･Low force control mode：1 - 50N in 0.1N increments
･High force control mode：10 - 300N in 1 N increments
• Bonding Tool Setting Temperature: RT.- 400℃ (in 1℃ increments　pulse heat)
• Bonding Stage Setting Temperature: RT.-120℃
• Chip Size: □2 - 20mm　t = 0.05 - 0.7mm
• Wafer Size: Max.φ300mm
• Workpiece Size: Width 40 - 100mm (Maximum bonding area = 90mm)
• Length :120 - 250mm (Maximum bonding area = 240mm)
• Thickness: 0.1 - 2.5mm