Detects foreign matter on the surface of sensitive components and automatically removes it with a gel stick.
| Applicable Components | CMOS, CCD, Wafers, MEMS, Silicon Microphones, and other surface-sensitive components |
| Minimum Detectable Particle Size | 2μm |
| Equipment Cleanliness Level | lSO Class 3 |
| Inspection Method | Built-in AOI (Automated Optical Inspection) recognition |
| Cleaning Method | Surface cleaning using compatible gel sticks |
| Equipment Dimensions | W 1100 xD900 xH1650 mm |
| Maximum Tray Dimensions | W 120-300 mmD 45 -110 mmT 0.2 -2 mm |
| Operating Mode | Supports both inline and standalone operation |
| Processing Efficiency | Approximately 2,600 units/hour (actual throughput depends on component size and particle count) |
