Detects foreign matter on the surface of sensitive components and automatically removes it with a gel stick.
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Applicable Components |
CMOS, CCD, Wafers, MEMS, Silicon Microphones, and other surface-sensitive components |
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Minimum Detectable Particle Size |
2μm |
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Equipment Cleanliness Level |
lSO Class 3 |
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Inspection Method |
Built-in AOI (Automated Optical Inspection) recognition |
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Cleaning Method |
Surface cleaning using compatible gel sticks |
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Equipment Dimensions |
W 1100 xD900 xH1650 mm |
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Maximum Tray Dimensions |
W 120-300 mmD 45 -110 mmT 0.2 -2 mm |
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Operating Mode |
Supports both inline and standalone operation |
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Processing Efficiency |
Approximately 2,600 units/hour (actual throughput depends on component size and particle count) |
