- For double sided FPC process
- Direct copper to copper bond at interconnect
- Rapid process, quick start up and few process steps
- Dramatic reduction in energy usage and support costs
- Environmentally friendly
- For double sided FPC process
- Direct copper to copper bond at interconnect
- Rapid process, quick start up and few process steps
- Dramatic reduction in energy usage and support costs
- Environmentally friendly
Model No.: Shadow®
URL: http://www.electrochemicals.com.cn
- For double sided FPC process
- Direct copper to copper bond at interconnect
- Rapid process, quick start up and few process steps
- Dramatic reduction in energy usage and support costs
- Environmentally friendly