• High-accuracy bonding by unique 3D-NRS technology

• High-productivity and space-saving footprint by adopting twin-head

• High-speed thin die pick-up system with a speed of 400ms / t:20um(option) *Depending on material conditions

• Friction-free bonding head with simultaneous positional and force control for thin die stacked devices

• Cleanness control with HEPA-filter and stainless steel full cover

• Equipped with die back-side camera on each bonding head, enhancing inspection function with a total of 8 cameras

• Capable of handling large substrates up to 120mm width x 300mm length

• Bonding Method: DAF bonding

• Accuracy: XY：±5μm (3σ)、θ：±0.05°(3σ) (Machine accuracy excluding material-induced factors)

• Productivity: The productivity increased by 2.5 times compared with conventional model.
(Theoretical value with Shinkawa's standard sample)

• Chip Size: □0.8 – 25mm

• Wafer Size: Maximum 12-inch

• Substrate/Leadframe Size: Width： 40 – 120mm，

• Length: 180 – 300mm，Thickness: 0.05 – 0.8mm