• Platform that achieved high speed bonding of 42ms/0.7mm (45ms/2 mm) with completely updated X, Y and Z motors
• Bonding accuracy of±3.0μm（3σ）achieved
• Capable of indexing 102mm x 300mm lead frames by allowing Y bonding area of 95mm
• Simultaneous detection and bonding capability in X and Y directions

• Bonding Accuracy： ±3.0 μm (3 σ), (The bonding accuracy changes depending on the conditions of device and temperature)
• Bonding Speed： 42 ms/0.7 mm wire (45 ms/2 mm wire)
(with loop control and force detection mode) Using Shinkawa standard device
• Bonding Wire Length： 4 mm maximum (Varies depending on device conditions)
• Resolution： XY table: 0.1 μm, Z-axis: 0.1 μm
• Vibration Control： Shinkawa NRS - Non Reaction Servo System
• Bonding Area： X: 66mm - Camera offset,　Y: 95mm - Camera offset
• Wire Size： φ18–50 μm
• Bonding Force： 3–1,000 gf
• No. of Bonding Wires： 12,000 wires maximum
• Loader / Unloader： Fully automatic magazine stacker system (Option: stocker system)
• Workpiece Size： Width ：20–102 mm， Length： 95–300 mm，
• Thickness ：0.1 - 0.5 mm (Varies depending on type of device)
(Conversion parts are required when thickness changes)
• Production Management： Management of equipment availability through production management monitoring screen