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Large Panel Compression molding system LPM-600 MS LPM-600 Auto System

Manufacturer:  APIC YAMADA

Model No.:  LPM-600 MS LPM-600 Auto System

URL:   http://www.apicyamada.co.jp

Specifications

• FOWLP has brought about a manufacturing revolution for the semiconductor packaging.
• In the IoT world the ultimate cost reduction of the semiconductor devices is required with the higher productivity. This trend is applied to the packaging technologies as well. Now the large panel molding is going to be stated.
• To comply to this mass-production requirement Apic Yamada offers LPM-600 series to handle a panel size 620 x 670mm. This is the largest panel size in the semiconductor packaging industry.
• LPM-600 enables the high precise one batch molding for metal carrier, glass substrate, PCB and other large panels.

Large Panel Compression molding system LPM-600 MS LPM-600 Auto System

Manufacturer:   APIC YAMADA

Model No.:   LPM-600 MS LPM-600 Auto System

URL:   http://www.apicyamada.co.jp

Specifications

• FOWLP has brought about a manufacturing revolution for the semiconductor packaging.
• In the IoT world the ultimate cost reduction of the semiconductor devices is required with the higher productivity. This trend is applied to the packaging technologies as well. Now the large panel molding is going to be stated.
• To comply to this mass-production requirement Apic Yamada offers LPM-600 series to handle a panel size 620 x 670mm. This is the largest panel size in the semiconductor packaging industry.
• LPM-600 enables the high precise one batch molding for metal carrier, glass substrate, PCB and other large panels.

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