• For the last few decades, Transfer molding technology has been at the height of its prosperity. Now, this technology is facing its physical limitations for the packaging of the forefront devices, because of the further miniaturization, longer wire, narrower wire pitch, multi layer dies, Low-K material, etc.
• The liquid compression molding, CDIM® technology is the best solution for these forefront devices, such as PoP, Multi-chip modules, as well as LED lens.
• This fully automated CDIM-500 shall materialize the new packages, which are still in your imagination.