Fixed optic or scanner setup
Single or dual process heads
Process gas (N2, O2, Ar, ...)
Processing one or more substrates in parallel
Automatic camera calibration
Automated routines for reference runs
Automated process control
Automated vision system for precision alignment and scaling, offset, trapezoidal and rotation compensation.
Stand alone and production line integrated systems

Accuracy < +/- 10 µm abs.
< +/- 2 µm repeatability
Substrate
Dimensions up to 29,5" x 25" (750 mm x 635 mm)
Thickness > 50 µm
Material PCB, Ceramic, Silicon, Steel
Available laser sources Wave length: 9.4, 10.6 µm (CO2)
1064, 1030, 532, 515, 355 nm
Pulse: µs, ns, ps, fs

Laser spot size 10 - 300 µm
Dimensions 2900 x 2800 x 2700 mm
Weight 5000 - 5500 kg
Power supply 200 - 480 V
Compressed dry air 6 - 7 bar
Cooling water 5 - 20 l/min